Semiconductor device, physical quantity sensor, electronic apparatus, and moving object

ABSTRACT

A semiconductor device includes a digital circuit having a scan test mode. The digital circuit includes a first flip-flop forming a part of a scan chain when in the scan test mode, and a first selector provided on an input side of the first flip-flop. The first selector is capable of selecting a first signal when not in the scan test mode, and selecting a second signal that is different from the first signal when in the scan test mode.

BACKGROUND

1. Technical Field

The present invention relates to a semiconductor device, a physicalquantity sensor, an electronic apparatus, and a moving object.

2. Related Art

Currently, physical quantity sensors capable of detecting variousphysical quantities, such as an acceleration sensor that detectsacceleration and a gyro sensor that detects angular velocity, arebroadly used in various systems and electronic apparatuses. In recentyears, very high reliability is required of various physical quantitysensors as these physical sensors are installed on automobiles. Tosecure high reliability, it is necessary to detect a failure (defect) ofa semiconductor device (IC) that processes an output signal from asensor element, with a probability of almost 100% in the inspectionprocess. As a technique for efficiently detecting a wiring failure(defect) in a digital circuit included in the semiconductor circuit(IC), a scan test is widely known in which flip-flops included in thedigital circuit are scanned, a test pattern generated by an ATPG (autotest pattern generation) tool is serially inputted to the scannedflip-flops (scan chain), then the scan chain is canceled so that thedigital circuit operates normally, the scan chain is configured againand a signal taken into the flip-flops in normal operation is seriallyoutputted outside, and the signal is compared with an expected value todetermine whether there is a failure or not. In a scan test, a failuredetection rate of approximately 90% is easily achieved. However, acertain measure needs to be taken in order to achieve a failuredetection rate closer to 100%. For example, the failure detection ratecan be made closer to 100% by inserting observation flip-flops into allthe nodes where a logical change cannot be detected despite itspresence. However, this technique leads to a significant increase incircuit scale due to the insertion of a large number of flip-flops.

Meanwhile, JP-A-11-271401 proposes a technique in which, when a scantest is carried out, the logic state in another combinational circuit istaken into a flip-flop for forming a shift register in a sequentialcircuit to be a test target. According to this technique, a flip-flopfor forming a shift register is used as an observation flip-flop at thetime of the scan test, without adding a new flip-flop. Therefore, thefailure detection rate can be improved while an increase in circuitscale can be restrained.

However, the technique disclosed in JP-A-11-271401 lacks versatilitybecause a flip-flop used as an observation flip-flop is limited to aflip-flop forming a shift register. Moreover, in the technique ofJP-A-11-271401, in addition to a scan selection signal that causes aflip-flop to operate as a scan circuit shift register, a scan modesignal for supplementary observation operation in order to take in thelogic state in a combinational circuit to be observed in the test needsto be additionally provided, and the selection logic of the input signaland the control signal of the selector need to be changed between theflip-flop forming the shift register and the other flip-flops.Therefore, the scan test design becomes complicated, leading to designerrors.

SUMMARY

An advantage of some aspects of the invention is that a semiconductordevice, a physical quantity sensor, an electronic apparatus and a movingobject in which the failure detection rate can be improved whilerestraining an increase in circuit scale can be provided by using atechnique with high versatility that enables an easier scan test design.

The invention can be implemented as the following forms or applicationexamples.

Application Example 1

This application example is directed to a semiconductor device includinga digital circuit having a scan test mode. The digital circuit includesa first flip-flop forming a part of a scan chain when in the scan testmode, and a first selector provided on an input side of the firstflip-flop and capable of selecting a first signal when not in the scantest mode, and capable of selecting a second signal that is differentfrom the first signal when in the scan test mode.

The “scan chain” may be one scan chain extending from one input terminalto one output terminal or may be plural scan chains extending fromseparate input terminals to separate output terminals respectively.

The “first selector” provided on the input side of the first flip-flopmay be a selector provided immediately before the input terminal of thefirst flip-flop or may be selector provided at a stage preceding theinput terminal of the first flip-flop with a logic circuit arrangedin-between.

The expression “capable of selecting a second signal” includes the casewhere the second signal is always selected and the case where the secondsignal is selected only if a predetermined condition is met.

According to the semiconductor device of this application example, thefirst selector selects the second signal at the time of the scan testmode. Therefore, the second signal (including a signal resulting fromthe second signal propagating through a logic circuit) can be held atthe first flip-flop. Since the first flip-flop is a flip-flop forming apart of the scan chain, an output signal from the first flip-flop can beobserved from outside. Thus, by setting a signal that is impossible ordifficult to observe from outside, as the second signal, or by setting asignal that can be set from outside as the second signal when the firstsignal is impossible or difficult to set from outside, the defectionfailure rate of the digital circuit can be improved.

Also, according to the semiconductor circuit of this applicationexample, a flip-flop that functions in a normal operation mode is usedas the first flip-flop. Therefore, a dedicated observation flip-flop forthe scan test mode need not be added. Since it suffices to add aselector with a significantly smaller circuit area than the flip-flop,an increase in circuit scale can be restrained.

This technique for improving the defect failure rate is highly versatilesince an arbitrary flip-flop forming the scan chain can be selected asthe first flip-flop. Also, if there are plural first selectors, a commoncontrol signal can be used for the first selectors and therefore thetest design can be made easier.

Application Example 2

In the semiconductor device according to the application exampledescribed above, the digital circuit may include a second flip-flop thatforms a part of the scan chain when in the scan test mode and thatoutputs an output signal of the second flip-flop as the second signal,and the semiconductor device may include at least one logic elementprovided in a signal path extending from an output of the first selectorto an input of the first flip-flop.

According to the semiconductor device of this application example, sincethe second flip-flop is a flip-flop forming a part of the scan chain, anarbitrary signal can be set to the second flip-flop from outside.Therefore, even if the first signal is impossible or difficult to setfrom outside, failure detection in the logic element on the signal pathextending from the output of the first selector to the input of thefirst flip-flop can be carried out by using an output signal from thesecond flip-flop as the second signal. Thus, the failure detection rateof the digital circuit can be improved.

Application Example 3

The semiconductor device according to the application example describedabove may include an analog circuit having an interface with the digitalcircuit, and the second signal may be an output signal from the digitalcircuit to the analog circuit.

According to the semiconductor device of this application example, sincean output signal from the digital circuit to the analog circuit isobservable from outside, a failure in the logic circuit (combinationalcircuit) that generates the output signal. Alternatively, the flip-flopthat generates an output signal to the analog circuit can be effectivelyused as a setting flip-flop when in the scan test mode. Therefore, thefailure detection rate of the digital circuit can be improved.

Application Example 4

In the semiconductor according to the application example describedabove, the second signal may be an input signal to a logic element inwhich a logic level of an output signal is fixed when in the scan testmode.

According to the semiconductor device of this application example, sincea signal that is immediately before the logic level is fixed isobservable from outside when in the scan test mode, a failure in thelogic circuit (combinational circuit) that generates the signalimmediately before the logic level is fixed can be detected. Therefore,the failure detection rate of the digital circuit can be improved.

Application Example 5

The semiconductor device according to the application example describedabove may include an analog circuit having an interface with the digitalcircuit, and the first signal may be an input signal to the digitalcircuit from the analog circuit.

According to the semiconductor device of this application example, afailure in the logic circuit (combinational circuit) to which an inputsignal from the analog circuit to the digital circuit is inputted can bedetected. Alternatively, the flip-flop to which an input signal from theanalog circuit to the digital circuit is directly inputted can beeffectively used as an observation flip-flop when in the scan test mode.Therefore, the failure detection rate of the digital circuit can beimproved.

Application Example 6

In the semiconductor device according to the application exampledescribed above, the first signal may be a signal in which a logic levelis fixed when in the scan test mode.

According to the semiconductor device of this application example, sincethe propagation to the subsequent circuit of a signal in which the logiclevel is fixed is stopped at the first selected when in the scan testmode and the second signal is inputted instead of the first signal, afailure in the subsequent circuit can be detected. Therefore, thefailure detection rate of the digital circuit can be improved.

Application Example 7

In the semiconductor device according to the application exampledescribed above, the first selector may constantly select the secondsignal when in the scan test mode.

According to the semiconductor device of this application example, sincea setting signal for the scan test mode can be a control signal for thefirst selector, the scan test design can be made easier.

Application Example 8

In the semiconductor device according to the application exampledescribed above, the digital circuit may include a third flip-flop thatforms a part of the scan chain when in the scan test mode, and the firstselector may select the first signal or the second signal in response toan output signal from the third flip-flop when in the scan test mode.

Since the third flip-flop is a flip-flop that forms a part of the scanchain, an arbitrary signal can be set to the third flip-flop fromoutside. Thus, when in the scan test mode, the first selector can selectnot only the second signal but also the first signal. Therefore, notonly failure detection in the logic circuit (combinational circuit) thatgenerates the second signal but also failure detection in the logiccircuit (combinational circuit) that generates the first signal can becarried out. Thus, even if there is only the logic circuit(combinational circuit) that generates the first signal, a fall in thefailure detection rate due to the provision of the first selector can beavoided.

Application Example 9

In the semiconductor device according to the application exampledescribed above, the second signal may be an output signal from amultiple-input logic circuit that does not function when not in the scantest mode.

According to the semiconductor device of this application example, evenif there are many signals that are impossible or difficult to observefrom outside and the number of flip-flops that can be used for the firstflip-flop is small, the plural signals that are impossible or difficultto observe from outside are inputted to the multiple-input logiccircuit, and an output signal from the multiple-input logic circuit isused as the second signal. Thus, the change in logic level of each ofthe plural signal is propagated into the output from the multiple-inputlogic circuit and can be observed from outside via the first flip-flop.

The multiple-input logic circuit may be, for example, an EXOR(exclusive-OR or exclusive logical sum) circuit. Since an output fromthe EXOR circuit changes when an odd number of input signals arechanged, the input signals are easily propagated into the output signal.Therefore, as plural signals that are impossible or difficult to observefrom outside are inputted to the EXOR circuit, observability can beimproved and the test pattern can be shortened, compared with the casewhere an AND circuit, OR circuit or the like is used.

Application Example 10

In the semiconductor device according to the application exampledescribed above, at least a part of input signals to the multiple-inputlogic circuit may be an output signal from the digital circuit to theanalog circuit, or an input signal to a logic element in which a logiclevel of an output signal is fixed when in the scan test mode.

Application Example 11

This application example is directed to a physical quantity sensorincluding a sensor element that detects a physical quantity, and one ofthe foregoing semiconductor devices that generates a signalcorresponding to the physical quantity, based on a detection signal fromthe sensor element.

The physical quantity sensor according to this application example maybe, for example, an inertial sensor such as an acceleration sensor, gyrosensor (angular velocity sensor) or velocity sensor, or may be aclinometer that measures an angle of inclination based on gravity.

Application Example 12

This application example is directed to an electronic apparatusincluding one of the foregoing semiconductor devices.

Application Example 13

This application example is directed to a moving object including one ofthe foregoing semiconductor devices.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 shows an example of the configuration of a semiconductor deviceaccording to a first embodiment.

FIG. 2 is an explanatory view of a signal propagation path in a normaloperation mode.

FIG. 3 is an explanatory view of a signal propagation path when a scanenable signal is at high level in a scan test mode.

FIG. 4 is an explanatory view of a signal propagation path when a scanenable signal is at low level in a scan test mode.

FIG. 5 shows an outline of a test pattern in a scan test.

FIG. 6 shows an example of the configuration of a semiconductor deviceaccording to a second embodiment.

FIG. 7 is a functional block diagram of a physical quantity sensoraccording to an embodiment.

FIG. 8 is a functional block diagram of an electronic apparatusaccording to an embodiment.

FIG. 9 shows an example of the appearance of an electronic apparatusaccording to an embodiment.

FIG. 10 shows an example of a moving object according to an embodiment.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, preferred embodiments of the invention will be described indetail with reference to the drawings. The embodiments described beloware not to unduly limit the content of the invention described in theappended claims. Not all the configurations described below areessential components of the invention.

1. Semiconductor Device 1-1. First Embodiment Circuit Configuration

FIG. 1 shows an example of the configuration of the semiconductor deviceaccording to a first embodiment. As shown in FIG. 1, a semiconductordevice 1 of the first embodiment includes a digital circuit 2 and analogcircuits 3. However, the semiconductor device 1 may not include theanalog circuits 3.

The digital circuit 2 is provided with input terminals T11 to T17 andoutput terminals T21 to T24.

A digital signal outputted from the analog circuit 3 (for example, anoutput signal from an A/D converter) is inputted to the input terminalsT11, T12, T13. The input terminals T14, T15, T16, T17 are electricallyconnected to external input terminals T1, T2, T3, T4 of thesemiconductor device 1, respectively. A digital signal inputted fromoutside the semiconductor device 1 is inputted to the input terminalsT14, T15, T16, T17 via the external input terminals T1, T2, T3, T4.

Digital signals outputted from the output terminals T21, T22, T23 areinputted to the analog circuit 3, for example, as control signals orsetting signals. The output terminal T24 is electrically connected to anexternal output terminal T5 of the semiconductor device 1. A digitalsignal outputted from the output terminal T24 is outputted outside ofthe semiconductor device 1 via the external input terminal T5.

The digital circuit 2 includes flip-flops 10 to 18, selectors 20 to 24,logic circuits 30 to 37, AND elements 40, 41, and an OR element 42.

The flip-flops (hereinafter referred to as “FFs”) 10 to 18 each have adata input terminal (D terminal), a clock input terminal, a scan datainput terminal (SD terminal), a scan enable input terminal (SEterminal), a reset terminal (R terminal), and a data output terminal (Qterminal). However, the FFs 10 to 18 may also include other terminalsthan these, for example, a reverse data output terminal (QN) or thelike.

The FFs 10 to 18 hold a signal inputted to the D terminal and outputsthe signal from the Q terminal when a scan enable signal SE inputted tothe SE terminal is at low level, at a riding edge of a clock signal CKinputted to the clock terminal. The FFs 10 to 18 holds a signal inputtedto the SD terminal and outputs the signal from the Q terminal when thescan enable signal SE is at high level. When a scan reset signal SRinputted to the R terminal is at high level, the FFs 10 to 18 areasynchronously reset and the signal outputted from the Q terminal fallsto low level.

The selectors 20 to 24 each have a first input terminal (0), a secondinput terminal (1), a control terminal, and an output terminal. When acontrol signal inputted from the control terminal is at low level, asignal inputted from the first input terminal is selected and outputtedfrom the output terminal. When the control signal is at high level, asignal inputted from the second input terminal is selected and outputtedfrom the output terminal.

The digital circuit 2 is set to a scan test mode when a scan test signalST inputted from the external input terminal T2 via the input terminalT15 is at high level, and set to another mode than the scan test mode(normal operation mode or the like) when the scan test signal ST is atlow level.

Signal Propagation Path in Normal Operation Mode

FIG. 2 illustrates the signal propagation path in the normal operationmode. In FIG. 2, the signal propagation path in the normal operationmode is indicated by bold lines.

As shown in FIG. 2, a signal inputted from the analog circuit 3 to thedigital circuit 2 via the input terminal T11 propagates through theselector 20 and is inputted to the D terminal of the FF 10 and held inthe FF 10 at a rising edge of the clock signal CK.

The output signal from the FF 10 is inputted to the logic circuit 30 andpropagates into the output of the logic circuit 30 via one or plurallogic elements. The output signal from the logic circuit 30 is inputtedto the D terminal of the FF 11 and held in the FF 11 at a rising edge ofthe clock signal CK.

The output signal from the FF 11 is inputted to the logic circuit 31 andpropagates into the output of the logic circuit 31 via one or plurallogic elements. The output signal from the logic circuit 31 is outputtedto the analog circuit 3 via the output terminal T21.

A signal inputted from the analog circuit 3 to the digital circuit 2 viathe input terminal T12 propagates through the selector 21 and isinputted to the logic circuit 32. The signal inputted to the logiccircuit 32 propagates into the output of the logic circuit 32 via one orplural logic elements. The output signal from the logic circuit 32 isinputted to the D terminal of the FF 12 and held in the FF 12 at arising edge of the clock signal CK.

The output signal from the FF 12 is inputted to the logic circuit 33 andpropagates into the output of the logic circuit 33 via one or plurallogic elements. The output signal from the logic circuit 33 is inputtedto the D terminal of the FF 13 and held in the FF 13 at a rising edge ofthe clock signal CK. The output signal from the FF 13 is outputted tothe analog circuit 3 via the output terminal T22.

A signal inputted from the analog circuit 3 to the digital circuit 2 viathe input terminal T13 propagates through the selector 22 and isinputted to the D terminal of the FF 14 and held in the FF 14 at arising edge of the clock signal CK.

The output signal from the FF 14 is inputted to the logic circuit 34 andpropagates into the output of the logic circuit 34 via one or plurallogic elements. The output signal from the logic circuit 34 propagatesthrough the OR element 42 and the selector 23, is inputted to the logiccircuit 35, and propagates into the output of the logic circuit 35 viaone or plural logic elements. The output signal from the logic circuit35 is inputted to the D terminal of the FF 15 and held in the FF 15 at arising edge of the clock signal CK. The output signal from the FF 15 isoutputted to the analog circuit 3 via the output terminal T23.

A signal inputted from the external input terminal T1 to the digitalcircuit 2 via the input terminal T14 is inputted to the D terminal ofthe FF 16 and held in the FF 16 at a rising edge of the clock signal CK.

The output signal from the FF 16 is inputted to the logic circuit 36 andpropagates into the output of the logic circuit 36 via one or plurallogic elements. The output signal from the logic circuit 36 is inputtedto the D terminal of the FF 17 and held in the FF 17 at a rising edge ofthe clock signal CK.

The output signal from the FF 17 is inputted to the logic circuit 37 andpropagates into the output of the logic circuit 37 via one or plurallogic elements. Since the scan test signal ST is at low level, theoutput signal from the AND element 41 is fixed at low level. Therefore,the output signal from the logic circuit 37 propagates through theselector 24 and is inputted to the D terminal of the FF 18 and held inthe FF 18 at a rising edge of the clock signal CK. The output signalfrom the FF 18 is outputted to outside from the external output terminalT5 via the output terminal T24.

Signal Propagation Path in Scan Test Mode

In the scan test mode (when the scan test signal ST is at high level), asignal inputted to the digital circuit 2 from the external inputterminal T3 via the input terminal T16 propagates the AND element 40 andis inputted to the SE terminals of the FFs 10 to 18 as a scan enablesignal SE. A signal inputted from the external input terminal T4 via theinput terminal T17 is inputted to a scan reset signal SR and then to theR terminals of the FFs 10 to 18.

FIG. 3 illustrates the signal propagation path when the scan enablesignal is at high level in the scan test mode. In FIG. 3, the signalpropagation path when the scan enable signal is at high level in thescan test mode is indicated by bold lines.

A signal inputted to the digital circuit 2 from the external inputterminal T1 via the input terminal T14 is inputted to the SD terminal ofthe FF 16 and held in the FF 16 at a rising edge of the clock signal CK.

The output signal from the FF 16 is inputted to the SD terminal of theFF 17 and held in the FF 17 at a rising edge of the clock signal CK. Theoutput signal from the FF 17 is inputted to the SD terminal of the FF 14and held in the FF 14 at a rising edge of the clock signal CK. Theoutput signal from the FF 14 is inputted to the SD terminal of the FF 10and held in the FF 10 at a rising edge of the clock signal CK. Theoutput signal from the FF 10 is inputted to the SD terminal of the FF 12and held in the FF 12 at a rising edge of the clock signal CK. Theoutput signal from the FF 12 is inputted to the SD terminal of the FF 11and held in the FF 11 at a rising edge of the clock signal CK. Theoutput signal from the FF 11 is inputted to the SD terminal of the FF 13and held in the FF 13 at a rising edge of the clock signal CK. Theoutput signal from the FF 13 is inputted to the SD terminal of the FF 15and held in the FF 15 at a rising edge of the clock signal CK. Theoutput signal from the FF 15 is inputted to the SD terminal of the FF 18and held in the FF 18 at a rising edge of the clock signal CK. Theoutput signal from the FF 18 is outputted to outside from the externaloutput terminal T5 via the output terminal T24.

Therefore, when the scan enable signal SE is at high level in scan testmode, a scan in signal SIN inputted from the external input terminal T1propagates in order of the FF 16, FF 17, FF 14, FF 10, FF 12, FF 11, FF13, FF 15, and FF 18, at nine rising edges of the clock signal CK. Also,the respective output signals from the FF 18, FF 15, FF 13, FF 11, FF12, FF 10, FF 14, FF 17, and FF 16 are outputted in this order tooutside from the external output terminal T5 as a scan out signal SOUT,at eight rising edges of the clock signal CK. That is, when the scanenable signal SE is at high level, low level or high level can beseparately set for each of the FFs 10 to 18 from the external inputterminal T1, and at the same time as this setting, a scan chain in whichsignals held in the FFs 10 to 18 can be observed from the externaloutput terminal T5 is formed.

FIG. 4 illustrates the signal propagation path when the scan enablesignal is at low level in the scan test mode. In FIG. 4, the signalpropagation path when the scan enable signal is at low level in the scantest mode is indicated by bold lines.

As shown in FIG. 4, the output signal from the logic circuit 31propagates to the D terminal input of the FF 10 via the selector 20 andis held in the FF 10 at a rising edge of the clock signal CK.

The output signal from the FF 13 propagates to the input of the logiccircuit 32 via the selector 21 and propagates into the output of thelogic circuit 32 via one or plural logic elements.

The output signal from the logic circuit 34 propagates to the D terminalinput of the FF 14 via the selector 22 and is held in the FF 14 at arising edge of the clock signal CK.

The output signal from the FF 12 propagates to the input of the logiccircuit 35 via the selector 23 and propagates into the output of thelogic circuit 35 via one or plural logic elements.

The output signal from the FF 17 propagates through the AND element 41and is inputted to the control terminal of the selector 24.

When the output signal from the AND element 41 is at low level, theoutput signal from the logic circuit 37 propagates to the D terminalinput of the FF 14 via the selector 24. When the output signal from theAND element 41 is at high level, a signal from a predetermined nodeincluded in the logic circuit 36 propagates.

Since the scan test signal ST is at high level, the output signal fromthe logic circuit 34 cannot propagate through the OR element 42 and theoutput signal from the OR element 42 is fixed at high level.

The other parts of the signal propagation path when the scan enablesignal is at low level in the scan test mode are the same as the signalpropagation path in the normal operation mode shown in FIG. 2 andtherefore will not be described further in detail.

FIG. 5 shows an outline of a test pattern in a scan test. In thisembodiment, as shown in FIG. 5, the scan test signal ST is constantlyset at high level when a scan test is carried out.

First, both the clock signal CK and the scan enable signal SE are set atlow level and a high-level pulse is inputted as the scan reset signalSR. Thus, all the flip-flops FF 10 to FF 18 forming the scan chain arereset and the scan out signal falls to low level.

Next, the scan enable signal SE is set at high level and the clocksignal CK corresponding to nine clocks is inputted. Since the scanenable signal SE is at high level, a scan chain is formed and low-levelsignals outputted respectively from the FF 18, FF 15, FF 13, FF 11, FF12, FF 10, FF 14, FF 17, and FF 16 are outputted to outside in thisorder as the scan out signal SOUT, synchronously with the clock signalCK corresponding to nine clocks. Also, high-level or low-level signalsa1 to a9 are inputted in order as the scan in signal SIN, synchronouslywith the clock signal CK corresponding to nine clocks. Therefore, whenthe input of the clock signal CK corresponding to nine clocks isfinished, the signals a1 to a9 are held respectively in the FF 18, FF15, FF 13, FF 11, FF 12, FF 10, FF 14, FF 17, and FF 16.

Next, after the scan enable signal SE is set at low level, the clocksignal CK is inputted. Since the scan enable signal SE is at low level,the scan chain is canceled and the respective output signals a2 to a9from the FF 15, FF 13, FF 11, FF 12, FF 10, FF 14, FF 17, and FF 16propagate through one of the logic circuits 30 to 37 and are held in thesubsequent flip-flops at a rising edge of the clock signal CK. Thus, anoutput signal b1 from the FF 18 is outputted to outside as the scan outsignal SOUT. Also, a signal a10 is held in the FF 16 at a rising edge ofthis clock signal CK.

Next, the scan enable signal SE is set at high level again and the clocksignal CK corresponding to eight clocks is inputted. Since the scanenable signal SE is at high level, a scan chain is formed and respectiveoutput signals b2 to b9 from the FF 15, FF 13, FF 11, FF 12, FF 10, FF14, FF 17, and FF 16 are outputted to outside in this order as the scanout signal SOUT, synchronously with the clock signal CK corresponding toeight clocks. Also, high-level or low-level signals a11 to a18 areinputted in order as the scan in signal SIN, synchronously with theclock signal CK corresponding to eight clocks. Therefore, when the inputof the clock signal CK corresponding to eight clocks is finished, thesignals a10 to a18 are held respectively in the FF 18, FF 15, FF 13, FF11, FF 12, FF 10, FF 14, FF 17, and FF 16.

Next, after the scan enable signal SE is set at low level again, theclock signal CK is inputted. Since the scan enable signal SE is at lowlevel, the scan chain is canceled and the respective output signals a11to a18 from the FF 15, FF 13, FF 11, FF 12, FF 10, FF 14, FF 17, and FF16 propagate through one of the logic circuits 30 to 37 and are held inthe subsequent flip-flops at a rising edge of the clock signal CK. Thus,an output signal b10 from the FF 18 is outputted to outside as a scanout signal SOUT. Also, a signal a19 is held in the FF 16 at a risingedge of this clock signal CK.

Subsequently, the pattern of setting the scan enable signal SE set athigh level and inputting the clock signal CK corresponding to eightclocks while changing the input pattern of the scan in signal SIN, andthen setting the scan enable signal SE at low level and inputting theclock signal CK by one clock, is repeated. Then, the pattern of the scanout signal SOUT is compared with an expected value of an output patternthat should be obtained in connection with the input pattern of the scanin signal SIN. If the pattern does not match the expected value even byone bit, it can be determined that there is a failure in the digitalcircuit 2.

In this embodiment, the digital circuit 2 can be set to the normaloperation mode or the scan test mode, according to the level of the scantest signal ST inputted from the external input terminal T2. However,for example, a mode setting register and an interface circuit forsetting a value in the mode setting register from outside may beprovided in the digital circuit 2, so as to enable the setting of thenormal operation mode or the scan test mode by setting a desired valuein the mode setting register.

Explanation of Improvement Principles for Failure Detection Rate

In this embodiment, in order to improve the failure defection rate ofthe digital circuit 2, the selectors 20 to 24 are provided and thesignal path for propagation through the selectors 20 to 24 in the scantest mode is made different from the signal path in the normal operationmode. Hereinafter, the reasons for the improvement in the failuredetection rate based on the provision of the selectors 20 to 24 will bedescribed in detail in terms of each of the selectors.

Reason for Providing Selector 20

In the normal operation mode, the output signal from the logic circuit31 is outputted to the analog circuit 3 via the output terminal T21without being held in any flip-flop and is not outputted from anyexternal output terminal of the semiconductor device 1. Therefore, if ascan test is carried out without taking any measures for the circuit,the output signal from the logic circuit 31 cannot be monitored fromoutside and a failure in a part or the whole of the nodes in the logiccircuit 31 cannot be detected. Thus, in this embodiment, the selector 20(an example of the first selector) which selects the signal inputtedfrom the input terminal T11 (an example of the first signal) when thescan test signal ST is at low level (when not in the scan test mode) andwhich selects the output signal from the logic circuit 31 (an example ofthe second signal) when the scan test signal ST is at high level (whenin the scan test mode) is provided before the FF 10 (an example of thefirst flip-flop). That is, in the scan test mode, when the scan enablesignal SE is at low level, the output signal from the logic circuit 31is held in the FF 10 at arising edge of the clock signal CK. Since theFF 10 forms a part of the scan chain, the output signal from the logiccircuit 31 can be monitored from outside by doing a scan test.Therefore, the failure detection rate of the logic circuit 31 isimproved.

Reason for Providing Selector 21

In the scan test mode, the operation of the analog circuit 3 is stoppedfor the purpose of detecting a failure at each node in the digitalcircuit 2. The signal inputted to the digital circuit 2 from the analogcircuit 3 via the input terminal T12 is fixed at low level or highlevel. Therefore, if a scan test is carried out without taking anymeasures for the circuit, the failure detection rate of the logiccircuit 32 falls. Thus, in this embodiment, the selector 21 (an exampleof the first selector) which selects the signal inputted from the inputterminal T12 (an example of the first signal) when the scan test signalST is at low level (when not in the scan test mode) and which selectsthe output signal (an example of the second signal) from the FF 13 (anexample of the second flip-flop) when the scan test signal ST is at highlevel (when in the scan test mode) is provided before the logic circuit32. That is, in the scan test mode, when the scan enable signal SE is atlow level, the output signal from the FF 13 is inputted to logic circuit32, instead of the signal inputted from the input terminal T12, and theoutput signal from the logic circuit 32 is held in the FF 12 (an exampleof the first flip-flop) at a rising edge of the clock signal CK. Sincethe FF 12 and FF 13 form a part of the scan chain, the input signal tothe logic circuit 32 can be arbitrarily set and the output signal fromthe logic circuit 32 can be monitored from outside by doing a scan test.Therefore, the failure detection rate of the logic circuit 32 isimproved.

Reason for Providing Selector 22

The output signal from the logic circuit 34 and the scan test signal STare inputted to the OR element 42. When in the scan test mode (when thescan test signal ST is at high level), the output signal from the ORelement 42 is fixed at high level. Therefore, if a scan test is carriedout without taking any measures for the circuit, the output signal fromthe logic circuit 34 (with a variable logic level) cannot be monitoredfrom outside and the failure detection rate of the logic circuit 34falls. Thus, in this embodiment, the selector 22 (an example of thefirst selector) which selects the signal inputted from the inputterminal T13 (an example of the first signal) when the scan test signalST is at low level (when not in the scan test mode) and which selectsthe output signal from the logic circuit 34 (an example of the secondsignal) when the scan test signal ST is at high level (when in the scantest mode) is provided before the FF 14 (an example of the firstflip-flop). That is, in the scan test mode, when the scan enable signalSE is at low level, the output signal from the logic circuit 34 is heldin the FF 14 at a rising edge of the clock signal CK, instead of thesignal inputted from the input terminal T12. Since the FF 14 forms apart of the scan chain, the output signal from the logic circuit 34 canbe monitored from outside by doing a scan test. Therefore, the failuredetection rate of the logic circuit 34 is improved.

Reason for Providing Selector 23

Also, in the normal operation mode, the scan test signal ST is at lowlevel and therefore the output signal from the logic circuit 34propagates through the OR element 42 and is inputted to the logiccircuit 35, whereas in the scan test mode (when the scan test signal STis at high level), the input signal to the logic circuit 35 is fixed athigh level by the OR element 42. Therefore, if a scan test is carriedout without taking any measures for the circuit, the failure detectionrate of the logic circuit 35 falls. Thus, in this embodiment, theselector 23 (an example of the first selector) which selects the outputsignal from the OR element 42 (an example of the first signal) when thescan test signal ST is at low level (when not in the scan test mode) andwhich selects the output signal (an example of the second signal) fromthe FF 12 (an example of the second flip-flop) when the scan test signalST is at high level (when in the scan test mode) is provided before thelogic circuit 35. That is, in the scan test mode, when the scan enablesignal SE is at low level, the output signal from the FF 12 is inputtedto logic circuit 35, instead of the output signal from the OR element42, and the output signal from the logic circuit 35 is held in the FF 15(an example of the first flip-flop) at a rising edge of the clock signalCK. Since the FF 12 and FF 15 form a part of the scan chain, the inputsignal to the logic circuit 35 can be arbitrarily set and the outputsignal from the logic circuit 35 can be monitored from outside by doinga scan test. Therefore, the failure detection rate of the logic circuit35 is improved.

Reason for Providing Selector 24

In the scan test mode, when a part of the nodes in the logic circuit 36is fixed at high level or low level, if a scan test is carried outwithout taking any measures for the circuit, the failure detection ratefalls in the circuit part that precedes the node. Thus, in thisembodiment, the selector 22 (an example of the first selector) whichselects the output signal from the logic circuit 37 (an example of thefirst signal) when the output signal from the AND element 41 is at lowlevel (when not in the scan test mode) and which selects the signal froma predetermined node with a variable logic level (an example of thesecond signal) that is immediately before the node where the logic levelof the logic circuit 36 is fixed, when the output signal from the ANDelement 41 is at high level (when in the scan test mode), is providedbefore the FF 18 (an example of the first flip-flop). When the scan testsignal ST is at a low level (when not in the scan test mode), the outputsignal from the AND element 41 is at low level. When the scan testsignal ST is at high level (when in the scan test mode), the outputsignal from the FF 17 (an example of the third flip-flop) propagates tothe output of the AND element 41. That is, in the scan test mode, whenthe scan enable signal SE is at low level, one of the output signal fromthe logic circuit 37 and the signal from a predetermined node in thelogic circuit 36 is held in the FF 18 at a rising edge of the clocksignal CK, according to the logic level of the output signal from the FF17. Since the FF 17 forms a part of the scan chain, the output signalfrom the FF 17, that is, the control signal of the selector 24 in thescan test mode, can be freely set at high level or low level from theexternal input terminal T1. Moreover, since the FF 18 forms a part ofthe scan chain, the one of the output signal from the logic circuit 37and the signal from the predetermined node in the logic circuit 36 canbe monitored from outside by doing a scan test. Therefore, the failuredetection rate of the logic circuit 36 and the logic circuit 37 isimproved. If the control signal of the selector 24 is fixed to the scantest signal ST, as in the selectors 20 to 23, the selector 24 constantlyselects the signal from the predetermined node in the logic circuit 36when in the scan test mode, and failure detection cannot be carried outin the logic circuit 37. However, by using the output signal from the FF17 propagated through the AND element 41 as the control signal of theselector 24, it is possible to carry out failure detection in the logiccircuit 37.

As described above, according to the semiconductor device of the firstembodiment, when in the scan test mode, the selectors 20, 22 and 24respectively select a signal that is impossible or difficult to observefrom outside, and the signal can be held in the FF 10, FF 14 and FF 18forming a part of the scan chain. Therefore, the failure detection rateof the digital circuit 2 can be improved.

Also, according to the semiconductor device of the first embodiment,when in the scan test mode, the selector 21 selects the output signalfrom the FF 13 forming a part of the scan chain, and the output signalfrom the logic circuit 32 can be held in the FF 12 forming a part of thescan chain. Therefore, the failure detection rate of the digital circuit2 can be improved.

Moreover, according to the semiconductor device of the first embodiment,when in the scan test mode, the selector 23 selects the output signalfrom the FF 12 forming a part of the scan chain, instead of the outputsignal from the OR element 42 that is fixed at high level. Therefore,failure detection in the logic circuit 35 can be carried out and thefailure detection rate of the digital circuit 2 can be improved.

In this way, according to the semiconductor device of the firstembodiment, it is not necessary to add a dedicated flip-flop forobservation in the scan test mode, and it suffices to add the selectors20 to 24 with a significantly smaller circuit area than a flip-flop.Therefore, an increase in circuit scale can be restrained.

This technique for improving the failure detection rate is highlyversatile because a selector can be provided on the input side of anarbitrary flip-flop forming the scan chain. Also, since a common controlsignal can be used for selectors, the test design can be made easier.

1-2. Second Embodiment

In the first embodiment, for example, if there are more output signalsfrom the digital circuit 2 to the analog circuit 3 than input signalsfrom the analog circuit 3 to the digital circuit 2, when in the scantest mode, the respective output signals cannot be separately inputtedto the selectors provided on the input side of the flip-flops to whichthe input signals are inputted respectively in the normal operationmode. Thus, in a second embodiment, a multiple-input logic circuit isprovided to which plural signals to be monitored when in the scan testmode are inputted, and an output signal from the multiple-input logiccircuit is inputted to a selector. The multiple-input logic circuit isprovided for the scan test mode and does not function (does notcontribute to the operation of the digital circuit 2 in the normaloperation mode) when not in the scan test mode (when in the normaloperation mode). The input signals to the multiple-input logic circuitare, for example, the output signals from the digital circuit 3 to theanalog circuit 2, or the input signals of logic elements having variableinput signal logic levels and fixed output signal logic levels when inthe scan test mode, or the like.

FIG. 6 shows an example of a configuration of a semiconductor deviceaccording to the second embodiment. In FIG. 6, the same components as inFIG. 1 are denoted by the same reference numerals. As shown in FIG. 6,the semiconductor device 1 of the second embodiment is different fromthe first embodiment in that, in the digital circuit 2, a logic circuit38 is provided between the data output terminal (Q terminal) of theflip-flop 13 and the output terminal T22, and a logic circuit 39 isprovided between the data output terminal (Q terminal) of the flip-flop15 and the output terminal T23. The semiconductor device 1 of the secondembodiment also includes a three-input EXOR element 43 (EXOR circuit)(an example of the multiple-input logic circuit) to which the outputsignal from the logic circuit 31 (the signal outputted from the outputterminal T21 to the analog circuit 3), the output signal from the logiccircuit 38 (the signal outputted from the output terminal T22 to theanalog circuit 3), and the output signal from the logic circuit 39 (thesignal outputted from the output terminal T23 to the analog circuit 3)are inputted. The output signal from the EXOR element 43 is inputted tothe second input terminal of the selector 20. The selector 20 selectsthe signal inputted from the analog circuit 3 to the digital circuit 2via the input terminal T11 when in the normal operation mode, andselects the output signal from the EXOR element 43 when in the scan testmode. Therefore, the EXOR element 43 does not function when in thenormal operation mode and functions only when in the scan test mode. Theother parts of the configuration in FIG. 6 are the same as those in FIG.1 and therefore will not be described further.

According to the semiconductor device of the second embodiment asdescribed above, the respective output signals from the logic circuits31, 38 and 39, which are impossible or difficult to observe fromoutside, are inputted to the EXOR element 43, and the output signal fromthe EXOR element 43 is inputted to the selector 20. Therefore, therespective output signals from the logic circuits 31, 38 and 39 areobservable from outside via the FF 10. Thus, even if the number ofoutput signals from the digital circuit 2 to the analog circuit 3 isgreater than the number of input signals from the analog circuit 3 tothe digital circuit 2, the failure detection rate of the digital circuit2 can be efficiently improved.

Also, according to the semiconductor device of the second embodiment,the circuit area can be reduced, compared with the case where threeselectors are separately provided in order to observe the respectiveoutput signals from the logic circuits 31, 38 and 39.

Moreover, according to the semiconductor device of the secondembodiment, since the output signal from the EXOR element 43 changeswhen an odd number of input signals are changed, the input signals caneasily propagate into the output signal. Therefore, compared with thecase where an AND circuit, OR circuit or the like is used, theobservability of the respective output signals from the logic circuits31, 38 and 39 can be improved and the test pattern can be shortened.

In addition, the semiconductor device of the second embodiment hassimilar effects to those of the semiconductor device of the firstembodiment.

2. Physical Quantity Sensor

FIG. 7 is an example of a functional block diagram of a physicalquantity sensor according to this embodiment. As shown in FIG. 7, aphysical quantity sensor 100 of this embodiment includes an integratedcircuit (IC) 110 and a sensor element 120.

In FIG. 7, the sensor element 120 is an oscillating-type piezoelectricangular velocity detection element in which two drive electrodes and twodetection electrodes are formed on a so-called double-T crystaloscillating piece including two T-shaped drive oscillating arms and onedetection oscillating arm between the drive oscillating arms.

When an AC voltage signal as a drive signal is applied to the two driveoscillating arms of the sensor element 120, an inverse piezoelectriceffect causes the drive oscillating arms to perform bending oscillation(excited oscillation) in which the distal ends of the two oscillatingarms repeat movements toward and away from each other. If the two driveoscillating arms have the same amplitude of bending oscillation, the twodrive oscillating arms perform bending oscillation constantly with linesymmetry about the detection oscillating arm. Therefore, the detectionoscillating arm does not oscillate.

If an angular velocity about a rotation axis that is perpendicular tothe excited oscillation plane of the sensor element 120 is applied inthis state, the two drive oscillating arms obtain a Coriolis force in adirection that is perpendicular to both the direction of bendingoscillation and the rotation axis. As a result, the symmetry of thebending oscillation of the two drive oscillating arms is broken anddetection oscillating arm performs bending oscillation in order to keepbalance. The bending oscillation of the detection oscillating arm andthe bending oscillation (excited oscillation) of the drive oscillatingarms due to the Coriolis force are shifted from each other in phase by90 degrees. With the piezoelectric effect, AC charges of the oppositephases (phases that are different from each other by 180 degrees) basedon the bending oscillation are generated in the two detectionelectrodes. The AC charges change according to the magnitude of theCoriolis force (that is, the magnitude of the angular velocity appliedto the sensor element 120).

The oscillating piece of the sensor element 120 is not limited to adouble-T form and may be, for example, in the form of a tuning fork orcomb, or may be a tuning bar in the shape of a triangular prism,quadratic prism, circular column or the like. The material of theoscillating piece of the sensor element 120 may be, for example, apiezoelectric material including piezoelectric single crystals such aslithium tantalate (LiTaO₃) and lithium niobate (LiNbO₃), andpiezoelectric ceramics such as lead zirconate titanate (PZT), or asilicon semiconductor, instead of quartz crystal (SiO₂). Also, forexample, a piezoelectric thin film of zinc oxide (ZnO), aluminum nitride(AlN) or the like held between the drive electrodes may be arranged in apart of the surface of a silicon semiconductor.

The sensor element 120 is not limited to a piezoelectric sensor elementand may be an oscillating-type sensor element using an electrodynamicsystem, electrostatic capacitance system, eddy-current system, opticalsystem, strain gauge system or the like. Alternatively, the type of thesensor element 120 is not limited to an oscillating-type and may be, forexample, an optical-type, rotary-type, or fluid-type. The physicalquantity detected by the sensor element 120 is not limited to angularvelocity and may include angular acceleration, acceleration, velocity,force and the like.

As shown in FIG. 7, in this embodiment, the two drive electrodes of thesensor element 120 are connected respectively to a DS terminal and a DGterminal of the integrated circuit (IC) 110. The two detectionelectrodes of the sensor element 120 are connected respectively to an S1terminal and S2 terminal of the integrated circuit (IC) 110.

The integrated circuit (IC) 110 includes a drive circuit 111, adetection circuit 112, a temperature sensor 113, a power-supply voltagesensor 114, a reference voltage circuit 115, a serial interface circuit116, a non-volatile memory 117, a switch control circuit 118, and aterminal function switching circuit 119. The integrated circuit (IC) 110of this embodiment may be configured by omitting or changing a part ofthe elements shown in FIG. 7 or by adding another element.

The reference voltage circuit 115 generates a constant voltage orconstant current such as a reference potential (analog ground voltage)from a power-supply voltage supplied from a VDD terminal and suppliesthe constant voltage or constant current to the drive circuit 111, thedetection circuit 112 and the temperature sensor 113.

The drive circuit 111 generates a drive signal for causing the sensorelement 120 to perform excited oscillation and supplies the drive signalto one of the drive electrode of the sensor element 120 via a DSterminal. The drive circuit 111 also receives, via a DG terminal, inputof a drive current (crystal current) generated in the other driveelectrode by the excited oscillation of the sensor element 120, andperforms feedback control of the amplitude level of the drive signal sothat the amplitude of the drive current is maintained at a constantlevel. The drive circuit 111 also generates a signal with a phaseshifted by 90 degrees from the phase of the drive signal and suppliesthe signal to the detection circuit 112.

The detection circuit 112 receives input of each of AC charges(detection currents) generated respectively in the two detectionelectrodes of the sensor element 120, via an S1 terminal and an S2terminal, then detects only an angular velocity component included inthese AC charges (detection currents), and generates a signal (angularvelocity signal) of a voltage level corresponding to the magnitude ofthe angular velocity. In this embodiment, the detection circuit 112converts the detection currents inputted from the S1 and S2 terminalsinto voltages, then performs A/D conversion of the voltages by using thesignal supplied from the drive circuit 111 (the signal with a phaseshifted by 90 degrees from the phase of the drive signal) as a samplingclock, and subsequently generates the detection signal (angular velocitysignal) by digital processing.

The temperature sensor 113 generates a signal in which the voltagechanges substantially linearly relative to temperature changes, thenperforms A/D conversion of the signal, and outputs the resulting signal.The temperature sensor 113 can be realized, for example, by using abandgap reference circuit.

The power-supply voltage sensor 114 performs A/D conversion of thepower-supply voltage value supplied from the VDD terminal and outputsthe resulting voltage value.

The non-volatile memory 117 holds various adjustment data and correctiondata for the drive circuit 111, the detection circuit 112 and thetemperature sensor 113. The non-volatile memory 117 can be realized, forexample, by a MONOS (metal oxide nitride oxide silicon)-type memory.

In the processing to generate the angular velocity signal, the detectioncircuit 112 carries out 0-point power-supply voltage correction, 0-pointtemperature correction, and sensitivity temperature correction of theangular velocity signal, using the digital output signals from thetemperature sensor 113 and the power-supply voltage sensor 114 and thecorrection data stored in the non-volatile memory 117.

The angular velocity signal (digital signal) generated by the detectioncircuit 112 is supplied to the serial interface circuit 116.

The terminal function switching circuit 119 switches connectiondestinations of four terminals IO1, IO2, IO3 and IO4. For example, underthe control of the switch control circuit 118, the terminal functionswitching circuit 119 can select the output signals or internal signalsof the drive circuit 111, the detection circuit 112 and the referencevoltage circuit 115, and output the selected signals to outside from oneof the IO1, IO2, IO3 and IO4 terminals, or can supply signals inputtedfrom outside via one of the IO1, IO2, IO3 and IO4 terminals, to thedrive circuit 111, the detection circuit 112 and the reference voltagecircuit 115.

The switch control circuit 118 controls the switching of the connectiondestinations of the four terminals IO1, IO2, IO3 and IO4, according to apreset value received from the serial interface circuit 116.

Also, for example, a part of the detection circuit 112, a part of thetemperature sensor 113, a part of the power-supply voltage sensor 114,the serial interface circuit 116, the switch control circuit 118, andapart of the terminal function switching circuit 119 are digitalcircuits, and the other parts are analog circuits.

In this embodiment, when a scan test signal inputted from a SCANTESTterminal is at high level, the scan test mode of the digital circuit isset. When in the scan test mode, for example, a clock signal is inputtedfrom an SCLK terminal, a scan in signal is inputted from an SI terminal,and a scan out signal is outputted from an SO terminal.

By incorporating the semiconductor device (IC) 1 of the above embodimentas the integrated circuit (IC) 110, the failure detection rate in theinspection process is improved. This enables realization of a physicalquantity sensor with higher reliability.

In the above embodiment, the physical sensor 100 for detecting angularvelocity as a physical quantity is described. However, a sensor fordetecting not only angular velocity but also other physical quantitiessuch as acceleration and velocity may also be employed. The detectioncircuit of such a physical quantity sensor can include, as an analogcircuit, at least a physical quantity signal generation circuit thatgenerates a signal (physical quantity signal) of a voltage levelcorresponding to a desired physical quantity from a detection current ofthe sensor element, and an A/D converter that performs A/D conversion ofthe generated physical quantity signal. Moreover, the detection circuitcan include, as a digital circuit, at least a digital processing circuitthat performs filtering, averaging and the like of the digital value ofthe physical quantity signal generated by the A/D converter.

3. Electronic Apparatus

FIG. 8 is a functional block diagram of an electronic apparatus of thisembodiment. FIG. 9 shows an example of an appearance of a smartphone asan example of the electronic apparatus of this embodiment.

An electronic apparatus 300 of this embodiment includes a physicalquantity sensor 310, a CPU (central processing unit) 320, an operationunit 330, a ROM (read only memory) 340, a RAN (random access memory)350, a communication unit 360, a display unit 370, and an audio outputunit 380. The electronic apparatus of this embodiment may also beconfigured by omitting or changing a part of the components (each unit)shown in FIG. 8 or by adding another component.

The physical quantity sensor 310 is a device which detects a physicalquantity and outputs a signal (physical quantity signal) of a levelcorresponding to the detected physical quantity. The physical quantitysensor 310 may be, for example, an inertial sensor which detects atleast a part of physical quantities such as acceleration, angularvelocity, and velocity, or may be a clinometer which measures an angleof inclination. The physical quantity sensor 310 includes an integratedcircuit 312. As the integrated circuit 312, the semiconductor device(IC) 1 of the above embodiment can be used. Also, as the physicalquantity sensor 310, for example, the physical quantity sensor 100 ofthe above embodiment can be used.

The CPU 320 carries out various kinds of calculation processing andcontrol processing using the physical quantity signal outputted from thephysical quantity sensor 310, in accordance with a program stored in theROM 340 or the like. In addition, the CPU 320 carries out various kindsof processing corresponding to an operation signal from the operationunit 330, processing to control the communication unit 360 in order tocarry out data communication with the outside, processing to transmit adisplay signal to cause the display unit 370 to display various kinds ofinformation, processing to cause the audio output unit 380 to outputvarious kinds of sounds, and the like.

The operation unit 330 is an input device including an operation key, abutton switch and the like, and outputs an operation signalcorresponding to a user's operation to the CPU 320.

The ROM 340 stores programs, data and the like for the CPU 320 to carryout various kinds of calculation processing and control processing.

The RAM 350 is used as a work area for the CPU 320 and temporarilystores programs and data read out from the ROM 340, data inputted fromthe operation unit 330, results of calculations executed by the CPU 320according to various programs, and the like.

The communication unit 360 carries out various controls to establishdata communication between the CPU 320 and an external device.

The display unit 370 is a display device including an LCD (LiquidCrystal Display) or organic EL display or the like, and displays variouskinds of information based on the display signal inputted from the CPU320. The display unit 370 may be provided with a touch panel thatfunctions as the operation unit 330.

The audio output unit 380 is a device that outputs sounds such as aspeaker.

By incorporating the semiconductor device (IC) 1 of the above embodimentas the integrated circuit 312, an electronic apparatus with higherreliability can be realized.

Various electronic apparatuses are conceivable as the electronicapparatus 300. Such electronic apparatuses may include, for example, apersonal computer (for example, mobile personal computer, laptoppersonal computer, notebook-type personal computer, or tablet-typepersonal computer), mobile terminal such as mobile phone, digital stillcamera, ink jet ejection device (for example, ink jet printer), storagearea network equipment such as router and switch, local area networkequipment, television set, video camera, video tape recorder, carnavigation system, pager, electronic notebook (including those withcommunication functions), electronic dictionary, electronic calculator,electronic game device, game controller, word processor, workstation, TVphone, surveillance television monitor, electronic binocular, POSterminal, medical equipment (for example, electronic thermometersphygmomanometer, glucose meter, electrocardiograph, ultrasonicdiagnosis device, and electronic endoscope), fishfinder, variousmeasuring devices, gauges (for example, gauges in vehicles, aircraft andvessels), flight simulator, head-mounted display, motion tracer, motiontracker, motion controller, PDR (pedestrian dead reckoning) positioningunit, and the like.

4. Moving Object

FIG. 10 is a top view showing an example of a moving object of thisembodiment. A moving object 400 shown in FIG. 10 includes physicalquantity sensors 410, 420, 430, controllers 440, 450, 460, and a battery470. The moving object of this embodiment may be configured by omittingor changing a part of the components (each unit) shown in FIG. 10 or byadding another component.

The physical quantity sensors 410, 420, 430 and the controllers 440,450, 460 operate with a power-supply voltage supplied from the battery470.

The physical quantity sensors 410, 420, 430 are devices which detect aphysical quantity and output a signal (physical quantity signal) of alevel corresponding to the detected physical quantity. Each of thephysical quantity sensors 410, 420, 430 may be, for example, an angularvelocity sensor, acceleration sensor, velocity sensor, clinometer, orthe like.

The controllers 440, 450, 460 respectively carry out various controls ofan attitude control system, a roll-over prevention system, a brakingsystem and the like, using a part or all of the physical quantitysignals outputted from the physical quantity sensors 410, 420, 430.

For example, the semiconductor device (IC) 1 of the above embodiment canbe used as the integrated circuit included in the physical quantitysensors 410, 420, 430 and the controllers 440, 450, 460 and the like, orthe physical quantity sensor 100 of the above embodiment can be used asthe physical quantity sensors 410, 420, 430. Thus, higher reliabilitycan be secured.

Various moving objects are conceivable as the moving object 400. Suchmoving objects may be, for example, an automobile (including electronicvehicles), aircraft such as jet plane and helicopter, vessel, rocket,artificial satellite and the like.

The invention is not limited to the embodiments and variousmodifications can be made without departing from the scope of theinvention.

For example, while in the above embodiments, all of the FF 10 to FF 18are included in one scan chain extending from the external inputterminal T1 to the external output terminal T5, these flip-flops may beincluded in one of plural scan chains, each extending from a separateexternal input terminal to a separate external output terminal.

The above embodiments are simply illustrative examples and not limiting.For example, the embodiments can also be suitably combined.

The invention includes the configurations described in the embodimentsand also substantially the same configurations (for example, aconfiguration having the same function, method and result, or aconfiguration having the same object and effect). The invention alsoincludes the configurations described in the embodiments in which anon-essential part is replaced. The invention also includes aconfiguration having the same advantages and effects as theconfigurations described in the embodiments, or a configuration that canachieve the same object. Moreover, the invention includes theconfigurations described in the embodiments to which a known techniqueis added.

The entire disclosure of Japanese Patent Application No. 2013-069497,filed Mar. 28, 2013 is expressly incorporated by reference herein.

What is claimed is:
 1. A semiconductor device comprising: a digitalcircuit having a scan test mode; wherein the digital circuit includes afirst flip-flop forming a part of a scan chain when in the scan testmode, and a first selector provided on an input side of the firstflip-flop and capable of selecting a first signal when not in the scantest mode, and capable of selecting a second signal that is differentfrom the first signal when in the scan test mode.
 2. The semiconductordevice according to claim 1, wherein the digital circuit includes asecond flip-flop that forms a part of the scan chain when in the scantest mode and that outputs an output signal of the second flip-flop asthe second signal, and the semiconductor device includes at least onelogic element provided in a signal path extending from an output of thefirst selector to an input of the first flip-flop.
 3. The semiconductordevice according to claim 1, including an analog circuit having aninterface with the digital circuit, wherein the second signal is anoutput signal from the digital circuit to the analog circuit.
 4. Thesemiconductor device according to claim 1, wherein the second signal isan input signal to a logic element in which a logic level of an outputsignal is fixed when in the scan test mode.
 5. The semiconductor deviceaccording to claim 1, including an analog circuit having an interfacewith the digital circuit, wherein the first signal is an input signal tothe digital circuit from the analog circuit.
 6. The semiconductor deviceaccording to claim 1, wherein the first signal is a signal in which alogic level is fixed when in the scan test mode.
 7. The semiconductordevice according to claim 1, wherein the first selector is constantlyselects the second signal when in the scan test mode.
 8. Thesemiconductor device according to claim 1, wherein the digital circuitincludes a third flip-flop that forms a part of the scan chain when inthe scan test mode, and the first selector selects the first signal orthe second signal in response to an output signal from the thirdflip-flop when in the scan test mode.
 9. The semiconductor deviceaccording to claim 1, wherein the second signal is an output signal froma multiple-input logic circuit that does not function when not in thescan test mode.
 10. The semiconductor device according to claim 9,wherein at least a part of input signals to the multiple-input logiccircuit is an output signal from the digital circuit to the analogcircuit, or an input signal to a logic element in which a logic level ofan output signal is fixed when in the scan test mode.
 11. A physicalquantity sensor comprising: a sensor element that detects a physicalquantity; and the semiconductor device according to claim 1 thatgenerates a signal corresponding to the physical quantity, based on adetection signal from the sensor element.
 12. A physical quantity sensorcomprising: a sensor element that detects a physical quantity; and thesemiconductor device according to claim 2 that generates a signalcorresponding to the physical quantity, based on a detection signal fromthe sensor element.
 13. An electronic apparatus comprising thesemiconductor device according to claim
 1. 14. An electronic apparatuscomprising the semiconductor device according to claim
 2. 15. A movingobject comprising the semiconductor device according to claim
 1. 16. Amoving object comprising the semiconductor device according to claim 2.